Conveyance system having identification attaching unit

ABSTRACT

A conveyance system includes a conveying unit, an alignment unit, and an attaching unit. The conveying unit conveys objects, packaged by one or more package members, in a given direction. The alignment unit, disposed at a given position along a conveyance route of the conveying unit, aligns a positional orientation of the packaged objects to a reference position when the packaged objects are conveyed by the conveying unit. The attaching unit attaches at least one electronic functional device to each of the packaged objects.

TECHNICAL FIELD

The present disclosure relates generally to a conveyance system used forsorting and conveying products, and more particularly to a conveyancesystem for attaching given specific information to products.

DESCRIPTION OF BACKGROUND ART

A technological field of “printable electronics” has been increasinglyresearched and developed in recent years. Such printable electronicsemploys a given printing method or process for fabricating functionaldevices such as electronic device, in which a solution including organicor inorganic material, used instead of print ink, is applied on asubstrate to form a functional device at a lower cost. Althoughelectronic devices such as IC (integrated circuits), LSI (large-scaleintegration), or the like, have been fabricated with a conventionalsemiconductor manufacturing process, such conventional method may needrelatively expensive equipment, which may be not preferable in someapplication fields.

Such printable electronics may employ a micro-contact printing method,an inkjet method, or the like, as printing process to fabricateelectronic devices, including electronic circuits and others, onsubstrates. Such inkjet method has been increasingly used as anothermethod for fabricating electronic devices (e.g., wiring pattern onsubstrate).

Further, an IC (integrated circuit) tag, having a small-sized IC chipstoring specific information and antenna for wireless communication, hasbeen increasingly researched and developed in recent years. Such IC tagmay also be referred as wireless IC tag, wireless tag, RFID (radiofrequency identification) tag, RF (radio frequency) tag, or the like.Such IC tag can be attached to products, delivery goods, commercialgoods, or the like, to manage, control, or check relevant information ofproducts or goods such as history information (e.g., used material,factory name, production date), delivery address information, or thelike.

Although such IC tag may have such useful function for managingproducts, such IC tag may still have drawbacks on its cost performancebecause an IC chip included in IC tag may be manufactured bysemiconductor manufacturing process using relatively expensiveequipment. If such cost performance of IC tags may be enhanced, auniform management system using IC tags may be conveniently used forindustrial fields. For example, a logistic system used for sorting anddelivering industrial or agricultural products may be effectively andefficiently conducted by attaching electronic functional devices havingspecific information on products or goods.

BRIEF SUMMARY

In an aspect of the present disclosure, a conveyance system including aconveying unit, an alignment unit, and an attaching unit is provided.The conveying unit conveys objects, packaged by one or more packagemembers, in a given direction. The alignment unit, disposed at a givenposition along a conveyance route of the conveying unit, aligns apositional orientation of the packaged objects to a reference positionwhen the packaged objects are conveyed by the conveying unit. Theattaching unit attaches at least one electronic functional device toeach of the packaged objects.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the disclosure and many of the attendantadvantages and features thereof can be readily obtained and understoodfrom the following detailed description with reference to theaccompanying drawings, wherein:

FIG. 1 illustrates an example of a process for packaging a product witha package member, according to an exemplary embodiment of the presentdisclosure;

FIG. 2 illustrates an example of a mechanism that can be used for thepackaging process of FIG. 1.

FIG. 3 illustrates a schematic view, of a conveyance system according toan exemplary embodiment of the present disclosure;

FIGS. 4A and 4B illustrate an example of a wiring pattern formed byjetting a solution with a jet head, according to an exemplary embodimentof the present disclosure;

FIGS. 5A and 5B illustrate a jetting process of a jet head utilizing apiezoelectric element;

FIG. 6 illustrates an exemplary structure of a jet head utilizing apiezoelectric element;

FIG. 7 illustrates an exemplary shape of a flying droplet dispensed fromthe jet head of FIG. 6;

FIG. 8 illustrates another exemplary shape of a flying droplet dispensedfrom the jet head of FIG. 6;

FIGS. 9A, 9B, and 9C illustrates an example of a jet head of a thermaltype;

FIG. 10 illustrates an exemplary shape of a flying droplet dispensedfrom the jet head of FIG. 9A.

FIG. 11 illustrates a multi-nozzle type jet head, viewed from a nozzleside;

FIG. 12 illustrates multi-nozzle type jet heads, stacked one on theother;

FIG. 13 illustrates a perspective view of the multi-nozzle type jet headof FIG. 12;

FIG. 14 illustrates a fabrication apparatus for fabricating a wiringpattern or an electronic device on a substrate, according to anexemplary embodiment of the present disclosure;

FIG. 15 illustrates a schematic cross-sectional view of an organictransistor element of top gate type fabricated by a fabrication methodaccording to an exemplary embodiment of the present disclosure;

FIG. 16 illustrates a schematic cross-sectional view of an organictransistor element of bottom gate type fabricated by a fabricationmethod according to an exemplary embodiment of the present disclosure;

FIG. 17 illustrates a schematic view for explaining a fundamental ofRFID device; and

FIG. 18 illustrates a schematic view of an example of a RFID deviceformed on a packaged product by a system according to an exemplaryembodiment of the present disclosure.

The accompanying drawings are intended to depict examples and exemplaryembodiments of the present invention and should not be interpreted tolimit the scope of the present disclosure and the appended claims. Theaccompanying drawings are not to be considered as drawn to scale unlessexplicitly noted, and identical or similar reference numerals designateidentical or similar components throughout the several views.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

A description is now given of examples and exemplary embodiments of thepresent invention. It should be noted that although such terms as first,second, etc. may be used herein to describe various elements,components, regions, layers and/or sections, it should be understoodthat such elements, components, regions, layers and/or sections are notlimited thereby because such terms are relative, that is, used only todistinguish one element, component, region, layer or section fromanother region, layer or section. Thus, for example, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present invention.

In addition, it should be noted that the terminology used herein is forthe purpose of describing particular embodiments only and is notintended to be limiting of the present disclosure and the appendedclaims. Thus, for example, as used herein, the singular forms “a”, “an”and “the” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise. Moreover, the terms “includes”and/or “including”, when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Further, although in describing examples and exemplary embodiments shownin the drawings, specific terminology is employed for the sake ofclarity, the present disclosure is not limited to the specificterminology so selected and it is to be understood that each specificelement includes all technical equivalents that operate in a similarmanner.

Referring now to the drawings, a method of packaging an object, such asa product, with a packaging member, according to an exemplary embodimentof the present disclosure, is described with particular reference toFIGS. 1 to 3.

FIG. 1 illustrates an example of a packaging process for packing anobject with a given method. Such object may be an industrial product orgoods, but not limited to these. In this disclosure, terms of “product”and “goods”, or “product name and goods name”, may be usedinterchangeably to indicate an object to be packed by a packagingprocess according to an exemplary embodiment of this disclosure. In FIG.1, an electronic dictionary is used as an object to be packed by apackaging process according to an exemplary embodiment, for example.

FIG. 1 shows an electronic dictionary 205, a package member 207, apackage substrate 208, and a packaged electronic dictionary 210. Thepackage substrate 208 may be made, but not limited, of paper, forexample. The package member 207 may have fold portions 207 a to 207 d, alower protection face 207 e, an upper protection face 207 f, and flaps207 g and 207 h, for example.

First, the electronic dictionary 205, shown in FIG. 1( a), manufacturedin a factory is encased in the package member 207. The package member207, shown in FIG. 1( c), may be prepared from the package substrate 208prepared from a rectangular heavy sheet having cutout and modifiedcorner portion, shown in FIG. 1( b). The package member 207 may have theabove-mentioned fold portion 207 a to 207 d for folding the packagemember 207.

As illustrated in FIG. 1( d), the lower protection face 207 e of thepackage member 207 is placed on the electronic dictionary 205, and theelectronic dictionary 205 and the package member 207 are inverted asillustrated in FIG. 1( e). Then the upper protection face 207 f of thepackage member 207 is folded and placed on the electronic dictionary205, and the flaps 207 g and 207 h are further folded to protect sidefaces of the electronic dictionary 205, by which the packaged electronicdictionary 210 is prepared as illustrated in FIG. 1( f).

In an exemplary embodiment of the present disclosure, an electronicfunctional device, such as an IC chip, is attached to a package when theelectronic dictionary 205 is packed. Such IC chip may be a chip formedon a silicon substrate, or may be a printable electronic functionaldevice, which will be described later with reference to FIG. 3, in whicha printable electronic functional device may be attached on a package ofpackaged products with a given printing method. Such electronicfunctional device may be a RFID (radio frequency identification) device(to be described later), for example. A RFID device includes an IC chip,integrated with a memory and an electronic circuit, and an antennahaving wired shape having a length of several microns (μm) to severalmillimeters (mm), wherein such antenna may also be integrated in an ICchip. Hereinafter, terms and “electronic functional device” or“electronic device” are interchangeably used in this disclosure.

In an exemplary embodiment of the present disclosure, such electronicfunctional device may be firmly attached and fixed to a package with anadhesive agent such as resin type agent, for example, so that theelectronic functional device cannot be removed from the package easily.For example, if someone tries to remove an electronic functional devicefrom a package, the electronic functional device may be removed onlywhen the package is destroyed. If an electronic functional device can beremoved from a package easily, such electronic functional device may bestolen and data stored in the electronic functional device may be usedin unauthorized manner (e.g., data leakage), which is not preferable.Although such device fixed condition may not completely prevent a theftof electronic functional device by breaking or destroying a package or atheft of packaged product itself, the above mentioned device fixingmethod may have some level of anti-theft effect of device or product, ormay prevent some level of data leakage or tampering by theft, forexample.

The IC chip can be made by any known methods. For example, an IC chipmay be made on a silicon substrate, paper, paper based substrate, aplastic substrate, such as PET (polyethylene terephthalate) or the like,by applying a solution having electronic function materials, to bedescribed later, with a given printing process such as jetting method,screen printing, or the like, on a substrate. Such printing process maypreferably be used when a package substrate has some complex surfaceshape due to a shape of industrial or agricultural products. Becausesome substrates such as plastic substrate may have some flexibility, anIC chip can flex its shape corresponding to a shape of package.

Further, such printing process may not need relatively expensiveequipment or facilities, and therefore fabrication cost of IC chiputilizing such process is lower. In general, such electronic functionaldevices may be discarded with packages when packaged products aredelivered to destinations. Accordingly, such printing process, which maynot need relatively expensive equipment or facilities, may be preferableto fabricate such electronic functional devices with reduced cost.

A description is now given to a packaging mechanism used for theabove-described packaging process with reference to FIG. 2. Asillustrated in FIG. 2, a packaging mechanism 253 may include a table269, a robot arm unit 273 having a robot hand 273 a, a package handlingunit 274 having a pad 274 a, a first folding unit 275 and a secondfolding unit 276, for example. The first folding unit 275 may include afixed jig 278, and a movable jig 279, and the second folding unit 276may include a base 282, and a fold arm 283, for example.

The electronic dictionary 205, manufactured in a factory, is conveyedand placed on the table 269, as illustrated in FIG. 2. The robot armunit 273 picks up the electronic dictionary 205 from the table 269. Thepackage handling unit 274 holds the package member 207 with the pad 274a. The first folding unit 275 bends the package member 207 at its eachfolding portion. The second folding unit 276 packs the electronicdictionary 205 in the package member 207 by folding each folding portionof the package member 207.

The robot arm unit 273 and the package handling unit 274 have anarticulated robot arm having a multi-axial joint. The robot arm unit 273has the robot hand 273 a used for grasping the electronic dictionary 205and the package member 207. The package handling unit 274 has an armhaving the pad 274 a used for sucking and holding the package member207. The robot arm unit 273 and the package handling unit 274 are usedto place the electronic dictionary 205 on the lower protection face 207e of the package member 207, and then transport the electronicdictionary 205 and the package member 207 to the second folding unit276.

The first folding unit 275 includes the fixed jig 278, the movable jig279 movable along an end face of the fixed jig 278, and a move mechanism(not shown) for moving the movable jig 279 in upward/downward direction.The first folding unit 275 is used to bend the package member 207 at thefold portions 207 a to 207 d.

The second folding unit 276 includes the base 282, which places theelectronic dictionary 205 overlaid with the package member 207, the foldarm 283 for folding the upper protection face 207 f of the packagemember 207 onto the electronic dictionary 205, and a pivot mechanism(not shown) for pivoting the fold arm 283. On the second folding unit276, the upper protection face 207 f of the package member 207 is foldedonto the electronic dictionary 205 along the fold portion, and the flaps207 g and 207 h are also folded onto side faces of the electronicdictionary 205, by which the packaged electronic dictionary 210 isprepared.

The package member 207 may be prepared from the package substrate 208stocked in advance for mass production of products. Although the packagemember 207 is prepared from the package substrate 208 by using thepackaging mechanism 253 when the electronic dictionary 205 is conveyed,such package member 207 can be prepared and stocked in advance of theconveyance of the electronic dictionary 205.

Such packaged electronic dictionary 210 may then be conveyed to aproduct sorting system shown in FIG. 3. Specifically, packaged products(e.g., packaged electronic dictionary 210) may be conveyed to a position(A) in FIG. 3, and then sorted by a product sorting system. After suchsorting process, packaged products are handled by a logistic system todeliver products to the market (e.g., retail store/customer). Althoughan industrial product is used for describing a packaging processaccording to an exemplary embodiment of the present disclosure, suchpackaging process can be applied to any products in any business field.

A description is now given to such product sorting system with referenceto FIG. 3. Such product sorting system may include a first conveyancebelt 1, a second conveyance belt 2, packaged products 3, a guide member4, a pretreatment unit 5, a jet head 6, a dry unit 7, a covering agentattaching unit 8, and an information writer/reader 9, for example.

In such product sorting system, the packaged products 3 are conveyed onthe first conveyance belt 1 in a direction shown by an arrow. Duringsuch conveyance, the guide member 4 corrects or controls a position ofthe packaged products 3 on the first conveyance belt 1 at a givenposition with a higher precision. After such positional correction oralignment of the packaged products 3, an electronic functional device isformed on each of the packaged products 3 by the jet head 6. Then, theinformation writer/reader 9 writes data specifically assigned to eachelectronic functional device, formed on each of the packaged products 3,and the information writer/reader 9 may be also used for reading suchdata.

After reading such data, the packaged products 3 are conveyed from thefirst conveyance belt 1 to the second conveyance belt 2, having aplurality of lines, while sorting packaged products 3 depending oninformation stored in the electronic functional device. Such sortedpackaged products 3 are then transported to a given destination based ondelivery address information stored in the electronic functional device,for example.

The pretreatment unit 5 is used to set a surface of packaged products 3at a preferable condition for receiving a solution including electronicfunction material, to be jetted to such surface from the jet head 6, sothat a given pattern can be fabricated on each of the packaged products3 with a high precision. However, such pretreatment process can beomitted if the packaged products 3 have a surface condition preferablefor fabricating electronic functional devices thereon.

The dry unit 7 (e.g., heater, lamp) is used to vaporize a solventincluded in a solution having electronic function material so that solidcontent (i.e., electronic function material) can be deposited on thepackaged products 3, by which a given pattern having electronic functioncan be formed on the packaged products 3.

The dry unit 7 may use a halogen heater as a heat source and a reflectorfor reflecting heat energy generated by the halogen heater, for example.When such reflector is provided, generated heat energy can beeffectively used for drying a solution. The reflector may be made ofaluminum alloy having good luminance, and shaped in a parabolic shape,for example. Such parabolic shaped reflector may reflect heat energy ofthe halogen heater effectively, by which such heat energy can beeffectively used for drying a solution. The heat source may be a halogenlamp, sheathed heater, a ceramic heater, a thermistor, or the like, inaddition to a halogen heater, for example. Further, the dry unit 7 mayinclude a lens, for example, in which light coming from a light sourcecan be focused on a surface applied with a solution. Further, the dryunit 7 may include a reflector and a lens, for example, in which lightand heat may be effectively used for drying a solution efficiently.

Alternatively, the dry unit 7 may be a hot air unit, which blows hot airon the packaged products 3 to vaporize a solvent of a solution so thatsolid content is deposited on packaged products 3. Such hot air unit mayinclude a blow unit, a heat unit, and a hot air blowing port, forexample. The blow unit may be a fan, a pump, a compressor, or anaccumulator combined with these units. The heat unit may be a heatingelement made of nichrome wire, a halogen lamp, a sheathed heater, aceramic heater, or the like.

The dry unit 7 may be disposed at a position along a conveyance belt,which can dry a solution applied on the packaged products 3 effectively.Although the dry unit 7 may be disposed at a side position of the firstconveyance belt 1 in FIG. 3 to conduct a drying process to a side faceof the packaged products 3, the dry unit 7 may be disposed at anotherposition. For example, if the jet head 6 jets a solution on an upperside of the packaged products 3, the dry unit 7 may be disposed over anupper position of the first conveyance belt 1.

Further, the dry unit 7 may not need to dry each of the packagedproducts 3 as a whole but the dry unit 7 may preferably dry only a localsurface area applied with a solution on each of the packaged products 3.For example, if the packaged products 3 are fresh foods, vegetables,etc., a local drying process is preferable because such foods may bedegraded by heat. Further, a local drying process is preferable from aviewpoint of energy saving. Further, if air-drying can be employed, thedry unit 7 can be omitted.

The packaged products 3, conveyed on the first conveyance belt 1 may beindustrial products or agricultural crops packed in a package such aspaper sheet, corrugated cardboard, resin film/sheet, or a mail articlesand delivery goods, for example. Such package (or package member) may ormay not cover the content in the packaged products 3 entirely. As longas the package member can function for encasing and protecting contentduring a delivery process (e.g., truck transport), such package can beused without problems, even if some content may not be covered by thepackage.

As mentioned above, an electronic functional device is formed on thepackaged products 3 with the jet head 6 using an inkjet method, in whichthe jet head 6 jets a solution including electronic function material toa surface of packaged products 3. The electronic functional device maybe a RFID device, for example. The RFID device is then written withgiven specific information by the information writer/reader 9. Forexample, if the packaged products 3 are agricultural products, data ofweight, growing country/area, delivery address information, deliverydate, or the like, for example, may be written to such RFID device.

Such data stored in the RFID device formed on the packaged products 3 isthen read by the information writer/reader 9, and each of the packagedproducts 3 are conveyed from the first conveyance belt 1 to the secondconveyance belt 2, having a plurality of lines, while sorting each ofthe packaged products 3 depending on information stored in theelectronic functional device. Such sorted packaged products 3 are thentransported to given destinations based on delivery address informationstored in the electronic functional devices.

Although the information writer/reader 9, in one example, may include aninformation writer and an information reader integrally, an informationwriter and an information reader in another example may be separatelyprovided. Further, similar to the dry unit 7, the informationwriter/reader 9 can be disposed at any position with respect to theconveyance belt as long as the information writer/reader 9 can write orread information of the electronic functional device. For example, theinformation writer/reader 9 can be disposed at a side position, an upperposition, etc., of the conveyance belt in an exemplary embodiment of thepresent disclosure.

Although an electronic functional device can be formed on a surface of apackage (or package member) of packaged products by using the jet head 6after products are packaged as described above, such electronicfunctional device can be formed on a surface of a package member atanother timing. For example, if such electronic functional device isformed on a package member by known methods such as printing, or if suchelectronic functional device such as an IC chip is attached on a packagemember before the packaging process shown in FIGS. 1 and 2 is conducted,the jet head 6 can be omitted from the product sorting system shown inFIG. 3.

As above-described with FIG. 3, electronic functional devices can beformed on packaged products using the jet head 6 on an on-demand basis,if such on-demand device forming is preferable. Further, if packagemembers are formed with electronic functional devices thereon beforeconducting a packaging process, such package members having electronicfunctional devices can be prepared with a reduced cost with an effect ofmass scale production and printing of package members, which may bepreferable.

A description is now given to a pattern formed on a surface of a package(or package member) with reference to FIGS. 4A and 4B. FIGS. 4A and 4Billustrate an example of a pattern, having electrical function, formedon a substrate 10, made of paper or the like, by using the jet head 6employing a liquid jetting method according to an exemplary embodimentof the present disclosure. FIG. 4A shows a state that terminals 12 and13 are formed on the substrate 10, in which a dotted portion 11′indicates an area where a wiring pattern is to be formed. FIG. 4B showsa state that a wiring pattern 11 is formed on the substrate 10 bydispensing a solution including electronic function material by theliquid jetting method. The electronic function material may be fineparticles having conductivity, for example.

A description is now given to an inkjet technique used in an exemplaryembodiment of the present disclosure. In an exemplary embodiment, aninkjet technique is used to form an electronic device or electronicfunction device, to be described later, on a surface of the packagedproduct 3. In order to form an electronic device with a higherprecision, a positional relationship of the packaged products 3,conveyed on the first conveyance belt 1, and the jet head 6 may need tobe adjusted with a higher precision.

In an exemplary embodiment of the present disclosure, such positionalrelationship of the packaged products 3 and the jet head 6 can beadjusted by using the guide member 4 shown in FIG. 3. As illustrated inFIG. 3, the packaged products 3 placed on the position (A) are conveyedon the first conveyance belt 1 without aligning a package orientation ofthe packaged products 3. For example, some packages may be positionedcloser to a right side of the first conveyance belt 1, and some packagesmay be positioned closer to a left side of the first conveyance belt 1until the packages are conveyed to the guide member 4. However, when thepackaged products 3 pass through the guide member 4, the packagedproducts 3 are guided by an angled-entry-portion and then further guidedby a parallel wall portion of the guide member 4, by which a packageorientation of the packaged products 3 on the first conveyance belt 1may be aligned. As such the guide member 4 may be used as alignment unitfor positioning packaged products 3 on the first conveyance belt 1 at agiven reference position.

Accordingly, when the packaged products 3 pass through a position facingthe jet head 6, a distance between the packaged products 3 and the jethead 6 may be maintained at a given desired level. For example, adistance between the packaged products 3 and the jet head 6 may be setto a range of 0.3 mm to 3 mm, for example, wherein such distance rangemay be determined based on factors such as jet head type. The jet head 6(as droplet applicator) may employ any mechanism, that can dispense agiven amount of droplet. For example, the jet head 6 may preferablyemploy an inkjet mechanism, which is capable of dispensing dropletranging from 0.1 pl (pico liter) to several hundreds of pl (pico liter).

In inkjet method, an electrical signal is applied to a piezoelectricvibrator so as to convert the electrical signal into mechanicalvibration of the piezoelectric vibrator, which causes a droplet to bedispensed from a nozzle. Such method is generally known as adrop-on-demand method.

In another method, a droplet of a recording fluid containing acontrolled amount of electrostatic charge is produced using a continuousvibration generating technique. The produced droplet of the recordingfluid flies between polarizing electrodes applied with a uniformelectric field so as to reproduce images on a recording member. This isgenerally called the continuous flow method, or charge control method.

Further, in another method, air bubbles are generated in fluid, and thebubbles act on the fluid so as to cause a droplet to be dispensed from anozzle. This technique is generally called a thermal inkjet method orBubble Jet (registered trademark) method.

A user can select any one of drop-on-demand method, continuous flowmethod, and thermal inkjet method, in accordance with need.

Next, the jet head unit 6 according to an exemplary embodiment of thepresent disclosure is described with reference to FIGS. 5A, 5B, and 6.As illustrated in FIG. 6, the jet head unit 6 may have seven nozzles,for example.

As illustrated in FIGS. 5A and 5B, the jet head 6 includes apiezoelectric element 46 and a chamber 45, and a nozzle 48, for example.The piezoelectric element 46 generates and applies vibration energy tothe chamber 45, which stores solution 47, to dispense a droplet 43 fromthe nozzle 48. Specifically, a pulse signal is applied to thepiezoelectric element 46 to deform the piezoelectric element 46 as shownin FIG. 5A, by which a capacity of the chamber 45 is reduced and apressure wave occurs in the chamber 45. Such pressure wave causes thedroplet 43 to be dispensed from the nozzle 48. FIG. 5B illustrates astate where the piezoelectric element 46 returns to its original shape,by which the capacity of the chamber 45 is increased.

When the droplet 43 is dispensed from the jet head 6, the droplet 43 mayhave a shape as shown in FIG. 7 or FIG. 8, wherein the droplet 43 isdispensed by a force generated by the piezoelectric element 46, which isgenerated by converting electric power to mechanical displacement.Specifically, a flying droplet may have a substantially circular shapeas shown in FIG. 7, or a pillar-like shape extending in a flyingdirection shown by an arrow F in FIG. 8. Such flying droplet shown inFIG. 8 may have a circular portion having a diameter of d, and a lengthL as a whole, in which the length L may be within three times of thediameter d.

When a droplet is jetted from a nozzle of a jet head with an effect of apiezoelectric element, which converts electric energy to mechanicaldisplacement, a shape of droplet may be determined based on a pressureforce applied to a solution (e.g., liquid) from the piezoelectricelement, in which the pressure force may have differential values overtime. When such jet head employing a piezoelectric element is used forjetting a droplet with a given condition (e.g., drive pulse voltage), ajetted droplet may have a substantially circular shape, or a pillar-likeshape having a circular portion, in which a length of jetted droplet iswithin three times of a diameter of the circular portion as shown inFIGS. 7 and 8. In such condition, such jetted droplet may fly stablywithout receiving disturbances, in which a flying speed of droplet maybe in a range of 5 m/s to 12 m/s, for example.

In an exemplary embodiment of the present disclosure, such jet head 6may be used to dispense a solution including electronic functionmaterial on a substrate for forming a wiring pattern or an electronicdevice under such condition that a flying droplet has a shape shown inFIG. 7 or FIG. 8. If a dispensing condition of the jet head 6 deviatesfrom such desired condition shown in FIG. 7 or FIG. 8, an adjustmentprocess may be performed as follows. Specifically, a solution includingelectronic function material or an equivalent liquid (in terms ofviscosity, surface tension) is jetted from a jet head, and a shape ofjetted solution (or flying droplet) is observed with a microscope. Then,a drive pulse, applied to a piezoelectric element, is adjusted to adjusta shape of flying droplet to a desired shape shown in FIG. 7 or FIG. 8.Based on such adjustment process, an adjusted drive pulse signal is setfor driving the piezoelectric element of the jet head 6 to dispense adroplet having the above-described desired shape, in which such adjusteddrive pulse signal may be determined by setting a given value to pulsevoltage, pulse time, and pulse waveform. A microscope may be configuredwith a light source such as light emitting diode (LED) having flashinglight function to observe a shape of jetted solution (or flyingdroplet), for example.

As also illustrated in FIG. 6, the solution 47 is introduced into thechamber 45 through a filter 49, which may be provided within the jethead 6 to devise a filtering function at a given location proximity ofthe nozzle 48. Such filter 49 can trap foreign particles having a sizegreater than that of conductive fine particles or nanoparticles in asolution, to prevent deterioration of functionality of a wiring patternor an electronic device formed on a substrate. Such filter 49 can bemanufactured in compact size and simple structure, by which the jet head6 can be embedded with the filter 49 therein as shown in FIG. 6, bywhich the jet head 6 having the filter 49 can also be manufactured incompact size.

Preferably, the filter 49 may be made of a material such as stainlessmesh or resin material such as polytetrafluoroethylene or Teflon(registered trademark) and polypropylene, for example. In other words,the filter 49 should be made of a material having effectiveanti-corrosion to a solution used in an exemplary embodiment of thepresent disclosure. Further, the filter 49 may have a mesh size (or poresize), which can trap foreign material (or foreign particles) having asize, which is 30 times or greater than a diameter of fine particles ina solution.

Specifically, a solution containing fine particles (used as electronicfunction material) having a diameter of 0.0001 μm to 0.2 μm (0.1 nm to200 nm) is used, and more preferably, a solution containing fineparticles having a diameter of 0.0001 μm to 0.05 μm (0.1 nm to 50 nm) isused in an exemplary embodiment of the present disclosure. Accordingly,if the filter 49 may have a mesh size (or pore size), which can trapforeign material having a size of 0.003 μm to 0.6 μm, more preferably0.003 μm to 1.5 μm or greater, the filter 49 can trap such foreignmaterial having such size effectively, and thereby the nozzle 48 may notbe clogged by foreign material. Generally, a filtering performance (orremoval performance) of a filter may be measured in absolute removalrate or average removal rate. In an exemplary embodiment, the filter 49may have a mesh size (i.e., size of foreign material that can betrapped) determined based on absolute removal rate.

Although FIG. 6 shows a configuration that the filter 49 is embedded inthe jet head 6, the filter 49 is not required to be embedded in the jethead 6. Further, it should be noted that a plurality of filters can bedisposed for the jet head 6. If a plurality of filters is disposed, onefilter located at a position nearest to the nozzle 48 may have a meshsize described above, to effectively filter or remove foreign materialin a solution. Such filter 49 can similarly be provided to other jethead, using a thermal method or bubble method, to be described later, inaddition to the above-described jet head using a piezoelectric element,which converts electric energy to mechanical displacement.

Next, another jet head is described with reference to FIGS. 9A to 9C.FIGS. 9A to 9C illustrate a jet head 6 using bubble method, in which abubble is generated instantaneously in liquid by heating liquid to ahigher temperature (e.g., 300 to 500 degrees Celsius) in a short periodof time (e.g., 1 μs to 10 μs), and then a droplet is jetted from anozzle with an effect of such bubble. For example, such jet head iscalled edge-shooter type, which jets droplets from an end portion of aliquid chamber. The jet head 6 shown in FIG. 9A has four nozzles, forexample. Such jet head 6 can be manufactured by coupling a thermalelement unit 66 and a cover unit 67. The thermal element unit 66 has anindividual electrode 69, a common electrode 70, and a heating element71, which are formed on a silicon substrate 68 by a wafer process.

As illustrated in FIG. 9C, the cover unit 67 has grooves 74, and arecess 75, for example. The grooves 74 become channels for guidingsolution containing a functional material, and the recess 75 configuresa common fluid chamber for containing solution, which is to be guidedthrough the grooves 74. The cover unit 67 is combined with the thermalelement unit 66, as shown in FIG. 9A, to form the above-mentionedchannels and the common fluid chamber. When the thermal element unit 66and the cover unit 67 are coupled with each other, the heating element71 is positioned at a position corresponding to the channels. In suchconfiguration, nozzles 65 are formed at the ends of the channels, fromwhich a droplet of solution is dispensed. Although the shape of thenozzles 65 is formed in a rectangular shape in the example of FIGS. 9Ato 9C, the shape of the nozzles 65 may be formed in a circular shape inanother example.

With a consideration of stability of droplet jetting process, a nozzleplate may be provided on the nozzle 65 to set a desired nozzle diameterand a desired nozzle shape (e.g., circular shape). Such nozzle plate maybe made of a material, such as Ni, and formed with higher precision byusing an electroforming technique, for example. Alternately, a nozzleplate having nozzle holes may be formed by performing an excimer laserprocess on a resin film (substrate), for example. In addition, asolution inlet port 76 can be formed in the cover unit 67 to allowsupply of solution into the solution supply chamber using a supply unit(not shown).

When the droplet 43 is dispensed from the jet head 6 shown in FIG. 9A to9C, the droplet 43 may have a shape shown in FIG. 10, wherein thedroplet 43 is dispensed by a force of a bubble generated with an effectof heat generated by a heating element. Specifically, a flying dropletmay have a substantially pillar-like shape extending in a flyingdirection shown by an arrow F in FIG. 10. Such pillar-like shapeincludes a circular portion having a diameter d and a length L as awhole, in which the length L may be five times or greater than thediameter d.

When a droplet is jetted from a nozzle of a jet head by a bubble method,which uses a force of a bubble generated with an effect of heat from aheating element, a shape of droplet may be determined based on a forceapplied to a solution (e.g., liquid) by the bubble.

Compared to a jet head using a piezoelectric element for jetting adroplet, a jet head using bubble method can jet droplet with a higherpressure, by which a flying speed of droplets becomes relativelygreater, such as 8 m/s to 18 m/s, for example. When such jet heademploying a heating element is used for jetting a droplet with a givencondition, a jetted droplet may have a substantially pillar-like shapehaving a circular portion, in which a length of jetted droplet is fivetimes or greater than a diameter of the circular portion, and havingsatellite droplets SD as shown in FIG. 10. Because such satellitedroplets SD may also fly at a greater flying speed, the satellitedroplets SD may impact on a position on a substrate which has alreadybeen impacted by a pillar-like shape portion of droplet, and a wiringpattern or an electronic device can be formed on substrate correctly.

In an exemplary embodiment of the present disclosure, such jet head 6may be used to dispense a solution including electronic functionmaterial on a substrate for forming a wiring pattern or an electronicdevice under such condition that a flying droplet has a shape shown inFIG. 10. If a dispensing condition of the jet head 6 deviates from suchdesired condition shown in FIG. 10, an adjustment process may beperformed as follows. Specifically, a solution including electronicfunction material or an equivalent liquid (in terms of viscosity,surface tension, etc.) is jetted from a jet head, and a shape of jettedsolution (or flying droplet) is observed with a microscope. Then, adrive pulse, applied to a heating element, is adjusted to adjust a shapeof a flying droplet to a desired shape, such as shown in FIG. 10. Basedon such adjustment process, an adjusted drive pulse signal is set to afabrication apparatus of an exemplary embodiment and applied to aheating element of a jet head to dispense a droplet having theabove-described desired shape, in which such adjusted drive pulse signalmay be determined by setting a given value to pulse voltage, pulse time,and pulse waveform. For example, a pulse voltage or pulse time (orwidth) is incrementally increased to set a desired shape of droplet.

In an exemplary embodiment of the present disclosure, a plurality ofdroplets are applied to a substrate to form an electronic device or awiring pattern. Accordingly, if a jet head having multiple nozzles isused, an electronic device or a wiring pattern can be formed on asubstrate efficiently (e.g., in a shorter time). Although the jet head 6shown in FIG. 9 includes four nozzles, the number of nozzles can beadjusted to any given number to enhance pattern forming efficiency.However, if the number of nozzles is increased too great, amanufacturing cost of a jet head may be undesirably increased andnozzles may clog with a higher probability. Accordingly, the nozzlenumber of nozzles in a jet head may be determined based on considerationof several factors, such as apparatus manufacturing cost, apparatusmanufacturing efficiency, or the like.

FIG. 11 illustrates a jet head having multiple nozzles viewed from thenozzle 65. As illustrated in FIGS. 12 and 13, such jet head having amultiple-nozzle array may be provided as a jet head assembly, and suchjet head assembly may be used to dispense different kinds of solutionfrom different nozzle array. Specifically, as illustrated in FIGS. 12and 13, a jet head assembly includes jet heads A, B, C, and D, forexample. Each of the jet heads A, B, C, and D includes nozzles 65.Solutions containing different kinds of compounds (e.g., electronicfunction material, conductive fine particles, nanoparticles, etc.) canbe dispensed from the nozzles 65 of the respective jet heads A, B, C,and D.

In general, when an electronic device or the like is to be formed byusing such jet head, the jet head may need to move over packagedproducts in a relative manner. For example, an inkjet printer can have acarriage for carrying a jet head, in which the carriage may reciprocallymove in a first direction over a recording sheet, and the recordingsheet may move in a second direction perpendicular to the firstdirection when one line image is formed on the recording sheet step bystep. With such process using relative movement of the jet head and therecording sheet, a two-dimensional image can be form on the recordingsheet, for example.

In the exemplary embodiment of FIG. 3, the packaged products 3 areconveyed on the first conveyance belt 1, in which a package conveyingdirection may be one direction. If the jet head 6 shown in FIG. 3includes multiple nozzle heads arranged in another directionperpendicular to such package conveying direction, a two-dimensionalpattern for an electronic device can be formed on each of the packagedproducts 3 by adjusting a package conveying speed and a timing forjetting a solution including electronic function material from the jethead 6. In general, such electronic device may be formed by using aplurality of solutions including electronic function materials and bystacking a plurality of patterns one on the other. A plurality oflayered patterns for electronic device can be formed if another jet headand another dry unit is set next to the jet head 6 and the dry unit 7shown in FIG. 3, for example.

Alternatively, a plurality of layered patterns for electronic device canbe formed by one set of a jet head and a dry unit. For example, if aconveyance belt system allows switching of conveying direction of aconveyance belt, a packaged product may move over a position facing thejet head a plurality of times, and a plurality of layered patterns forelectronic device can be formed thereby on the packaged product.

Further, instead of using a conveying direction of a conveyance belt forforming a two-dimensional pattern for electronic device, a jet headmoving system may be employed, in which a carriage holding a jet headmay move over a packaged product. Such jet head moving system, used inan inkjet printer or plotter, may be preferable for forming a patternhaving higher precision.

For example, FIG. 14 illustrates a fabrication apparatus for forming awiring pattern or an electronic device according to an exemplaryembodiment of the present disclosure. The fabrication apparatus includesa jet head 21, a carriage 22, a substrate holder 23, a substrate 24, asupply tube 25, a signal cable 26, a jet head control box (including asolution tank) 27, an X-direction scanning motor 28, a Y-directionscanning motor 29, a computer 30, a control box 31, and a substratepositioning/holding unit 32 (32X1, 32Y1, 32X2, 32Y2), for example. Thesubstrate 24 may be used for forming a wiring pattern or an electronicdevice thereon, for example. The supply tube 25 is used to supply asolution including electronic function material from the solution tankto the jet head 21. The signal cable 26 is used to transmit signals fromthe jet head control box 27 to the jet head 21. The X-direction scanningmotor 28 and the Y-direction scanning motor 29 are used to move thecarriage 22. In such configuration, the jet head 21 is moved by scanningthe carriage 22 in X/Y direction indicated in FIG. 14 when to jet asolution containing electronic function material to the substrate 24disposed on the substrate holder 23.

Such jet head 21 held by the carriage 22 can move in X/Y directionindicated in FIG. 14, perpendicular to each other, with a higherprecision, and a desired electronic device can thereby be formed on thesubstrate 24. Accordingly, if packaged products can be conveyed to aposition, corresponding to the substrate 24, by a conveyance belt in anexemplary embodiment of the present disclosure, electronic devices canbe formed on packaged products with a higher precision.

Although a configuration shown in FIG. 14 may indicate that a solutionincluding electronic function material is jetted to packaged productsconveyed on the conveyance belt in a vertically downward direction,another configuration can also be employed. For example, if a carriage,holding a jet head, shown in FIG. 14 is rotated 90 degrees clockwise orcounterclockwise, such jet head may face packaged products such that asolution including electronic function material can be jetted to thepackaged products from a horizontal direction. Further, if one carriageincludes multiple nozzle heads arranged in one direction, atwo-dimensional pattern for electronic device can be formed on packagedproducts.

Although an IC chip or IC sheet can be formed on packaged products witha method, an apparatus, or a system according to an exemplary embodimentof the present disclosure, such IC chip may be different from an IC orLSI fabricated on a silicon wafer with patterns having a width dimensionof microns or sub-microns. In an exemplary embodiment, an IC chip mayhave a pattern width of 10 μm to 10 mm depending on the usage, forexample, wherein such IC chip may have a relatively lower circuitintegration compared to an IC formed on silicon wafer. Accordingly, anIC chip according to an exemplary embodiment can be formed on packagedproducts without using relatively expensive equipment used in aconventional semiconductor manufacturing process, which fabricates IC ona silicon wafer with higher precision.

In an exemplary embodiment of the present disclosure, a jet head mayapply a solution including electronic function material to a substrate(i.e., package), which may be a paper or paper-based material or thelike, to form an electronic device or a wiring pattern on packagedproducts. Such package may be a paper sheet, a corrugated cardboard, forexample, but not limited thereto. If paper is used as substrate, suchsubstrate may have surface properties, which may be attributed tocellulose fibers configuring the paper. For example, the surface of apaper may have concavities and convexities due to thickness variationsof cellulose fibers and space among cellulose fibers stacked one on theother. Such concavities and convexities may not be preferable forforming a wiring pattern sheet or electronic device sheet having higherquality.

In view of such situation, in an exemplary embodiment of the presentdisclosure, a relationship of surface properties of paper and wiringpattern or electronic device quality was evaluated. As described above,cellulose fibers may have a thickness of 5 μm to 20 μm, in general,although thickness of cellulose fibers may vary depending on types ofpapers. In general, a paper manufacturing process includes a beatingprocess for beating cellulose fibers by a beater to soften cellulosefibers. Accordingly, a paper product may be configured with cellulosefibers having a thickness that is smaller than 5 μm. Generally, a paperproduct manufactured with a beating process may be configured withcellulose fibers having a thickness of 4 μm to 10 μm, for example.

In view of such situation, in an exemplary embodiment of the presentdisclosure, a relationship between surface roughness of paper andquality of a wiring pattern or an electronic device was evaluated asfollows. As described above, paper has surface properties, such asconcavities and convexities, depending on the cellulose fibers andcoating material, which may affect pattern formation condition. Asdescribed later, papers having different surface properties wereprepared by adjusting fiber thickness, amount of coating material, andthen a wiring pattern for electronic device formed on each of papers.Such wiring pattern was evaluated by sensory evaluation method anddurability test of wiring pattern, wherein such wiring pattern is astraight pattern composed of a plurality of dots, superimposed one onthe other by superimposing a half of one dot to the adjacent dot.Further, a sensory evaluation was conducted to evaluate a shape of dotformed on a substrate.

In such paper preparation process, a roller coating method was employedto apply a coating material on paper, in which one whole face was coatedwith a coating material. Although a coating material can be applied to awhole face of paper by a spray coating method, a roller coating methodwas employed to uniformly apply a coating material on paper. Further,although a coating material can be applied on paper with an inkjetmethod, a roller coating method was employed to apply a coating materialon paper in a shorter time.

A wiring pattern was formed on a paper by using a jet head having apiezoelectric element, such as shown in FIGS. 5 and 6, with a nozzleplate provided on the jet head, wherein the nozzle plate was formed ofnickel (Ni) with an electro-forming technique and had a thickness of 20μm. Further, such jet head was provided with 256 nozzles and density ofnozzles was set to 180 dpi (dot per inch), and each nozzle had adiameter of 20 μm (or area of 314 μm²).

A solution used in an exemplary embodiment of the present disclosure wasprepared as water solution including colloidal silver, which wasprepared as follows.

First, DISPERBYK® 190 (BYK-Chemie GmbH, solid content ratio of 40% massweight) of 23.3 g and ion-exchanged water of 420.5 g were put intoKolben of 2 liters. Such Kolben was placed in a water bath, and stirredat 50 degrees Celsius until DISPERBYK® was dissolved. Silver nitrate of100 g having been dissolved into ion exchange water of 420.5 g was addedthereto while being stirred, and stirred at 70 degrees Celsius for 10minutes. Then, dimethylaminoethanol of 262 g was added thereto. Theliquid quickly changed its color to black, and liquid temperature roseto 76 degrees Celsius. The liquid was left as it was. When the liquidtemperature decreased to 70 degrees Celsius, it was continuously stirredat such temperature for two hours. As a result, water solution ofcolloidal silver colored dark yellow was obtained.

The resultant reaction liquid was transferred to a plastic bottle of 1liter, and the bottle was left standing in a constant temperature roomat 60 degrees Celsius for 18 hours. An ultrafiltering system wasconstructed with an ultrafiltration module AHP1010 (trade name of AsahiKasei Corporation, molecular weight cut off of 50000, number of filtersof 400), a magnet pump, and a stainless cup of 3 liters having tubeconnection ports at its lower part, which were interconnected to eachother with silicone tube. The reaction liquid having been left standingin a constant temperature room at 60 degrees Celsius for 18 hours wasput into a stainless cup, and ion exchange water of 2 liters was addedto the liquid. Then, the pump was operated to perform an ultrafilteringprocess. After about 40 minutes, a liquid filtered by the ultrafilteringmodule reached 2 liters. At this time, ethanol of 2 liters was put intothe stainless cup. Thereafter, it was confirmed that electricconductivity of the filtering liquid was 300 μS/cm or lower, and aconcentration process was carried out until an amount of mother liquidreached 500 ml.

Subsequently, another ultrafiltering system was constructed with a 500ml stainless cup, an ultrafiltering module (“AHP0013”, trade name ofAsahi Kasei Corporation; molecular weight cut off of 50000, number offilters of 100), a tube pump, and an aspirator. The mother liquidpreviously prepared was transferred into the stainless cup, and wasconcentrated to increase a solid concentration. When the mother liquidreached about 100 ml, operation of the tube pump was stopped, and at theend of the concentrating operation, a silver colloid ethanol solutionhaving a 10% solid was obtained.

An average particle diameter of the colloidal silver particle in thesolution was 0.017 μm (17 nm). The result of measurement by aninstrument TG-DTA (Seiko Instruments Inc.) showed that a content of thesilver in the solid was 90 mass weight % for 87 mass weight % of thecharge.

Such water solution having colloidal silver was dispensed on substrates(e.g., paper) having different surface properties with theabove-mentioned jet head to form a single dot, and a wiring patternformed of a plurality of dots by superimposing a half of each dot to anadjacent dot. A dot diameter was about 40 μm to 50 μm although the dotdiameter may vary depending on surface properties of substrate. Anelectrode pattern having a thickness of 0.5 μm was formed on each end ofthe substrate by sputtering aluminum (Al) in advance. The jet head wasapplied with a drive voltage of 30 V having drive frequency of 12 kHzfor driving a piezoelectric element.

After forming such wiring pattern on a substrate, the substrate wasplaced in an oven to dry the wiring pattern on a substrate at atemperature of 100 degrees Celsius for 10 minutes to obtain a driedlayer having a thickness of about 0.2 μm and metallic luster. Anelectrical conductivity of the dried layer was evaluated using surfaceresistivity measured with Loresta FP (Mitsubishi Chemical Corporation),and such surface resistivity was not measurable (e.g., 10⁸ Ω/sq. ormore).

After irradiating a light having energy of 5 J/cm² to such dried layerwith a low-pressure mercury lamp, the substrate was heated at 100degrees Celsius for 40 minutes to obtain a metal layer. An electricalconductivity of the metal layer was evaluated using surface resistivitymeasured with Loresta FP (Mitsubishi Chemical Corporation) and suchsurface resistivity was measured as 37.6 Ω/sq.

Then, power having a pulse voltage of 30 V and a pulse width of 50 mswas applied repeatedly between the electrode patterns with a pulseinterval of 100 ms for 60 minutes to evaluate whether broken wire occurson wiring pattern as durability test.

Table 1 and Table 2 show results of such evaluation test. A dot shapewas evaluated for each sample by sensory evaluation method withmicroscopic observation using 100 magnifications, and “O” representsacceptable and “X” represents unacceptable, wherein each evaluation wasconducted with sampled twenty dots. A durability test of wiring patternwas evaluated for each sample, and “O” represents no broken wire and “X”represents broken wire occurred.

Evaluation test 1 was conducted with paper using unbeaten fiber havingthickness of fibers of 6 μm to 15 μm, space among stacked fibers of 3 μmto 5 μm, and a coating material, which is a solution dispersing calciumcarbonate having a particle diameter of 1 μm using starch as binder.

TABLE 1 Surface roughness Dot shape No. Coating (μm) check Durability 1No coating  5-10 X X 2 One time 2-5 X X coating 3 Two times 1-2 ◯ ◯coating 4 Three times 1 ◯ ◯ coating

Evaluation test 2 was conducted with paper using beaten fiber havingthickness of fibers of 4 μm to 7 μm, space among stacked fibers of 3 μmto 4 μm, and a coating material, which is a solution dispersing calciumcarbonate having a particle diameter of 1 μm using starch as binder.

TABLE 2 Surface roughness Dot shape No. Coating (μm) check Durability 1No coating 3-5 X X 2 One time 1-2 ◯ ◯ coating 3 Two times 1 ◯ ◯ coating

In the above evaluation tests, surface property such as concavity andconvexity of paper used as substrate was smoothed by applying a coatingmaterial (e.g., calcium carbonate and starch), wherein the concavity andconvexity of paper is determined by thickness of cellulose fibers andspaces among stacked fibers. Based on results shown in Table 1 and Table2, when the surface roughness of paper is effectively suppressed bysurface treatment, compared to a level of concavity and convexity ofpaper before surface treatment, a dot having preferable shape can beformed, and a broken wire may not occur to a wiring pattern, by which awiring pattern having preferable shape and durability can be formed.

Further, in an exemplary embodiment of the present disclosure, othercoating material having insulation fine particles can be used. Forexample, porous polyimide fine particles having surface resistivity of10¹⁴ Ω/sq. or more prepared by adding amine catalytic agent to acidanhydride and diisocyanate, AlN fine particles having a size of 20 nm to30 nm prepared by injecting Al particles (20 μm) to arc plasma, or SiOxfine particles prepared by gas evaporation method can preferably beused.

Although surface properties or surface roughness (e.g., 3 μm to 10 μm),such as concavity and convexity of paper used as substrate, was smoothedby applying a coating material in the above evaluation tests, suchsmoothing pretreatment can be omitted in some cases. In one case, ifsmoothness of paper can be enhanced by employing a roller-used pressureprocess for fabricating paper, such smoothing pretreatment can beomitted. In another case, if an electronic device is formed with dotshaving a relatively greater size such as 100 μm to 500 μm, which causesless broken wire, such smoothing pretreatment can be omitted. As such, asmoothing pretreatment on a paper substrate can be omitted if a patternhaving an enough level of quality can be formed on a paper substrate.

A description is now given to electronic function materials usable in anexemplary embodiment of the present disclosure. A solution containingelectronic function material may be prepared by dispersing conductivefine particles in a solution, and such solution is dispensed as droplet43. For example, solutions including metal fine particles, such as Au,Pt, Ag, Cu, Ni, Cr, Rh, Pd, Zn, Co, Mo, Ru, W, Os, Ir, Fe, Mn, Ge, Sn,Ga, and/or In, are preferably used, or solutions including fineparticles of metal oxide of such metals are preferably used.Particularly, a fine circuit pattern, which has lower electricresistance and higher anti-corrosion, can be obtained by employing metalfine particles, such as Au, Ag, and Cu. In an exemplary embodiment, suchsolutions containing conductive fine particles may be prepared as anaqueous solution and an oil solution.

For example, an aqueous solution, which includes water as a dispersantand minute conductive fine particles dispersed therein, may be preparedas below.

First, a water soluble polymer is dissolved in a metal ion aqueoussolution (e.g. gold chloride, silver nitrate) and added withalkanolamine, such as dimethylaminoethanol, while being agitated. Thesolution is subjected to reduction of metal ions for several tens ofseconds to several minutes, and metal fine particles having an averagediameter of 0.5 μm (500 nm) or less is deposited. Then, chlorine ions ornitrate ions are removed by an ultrafiltration membrane, and thensubjected to concentration/drying to obtain a solution containingconcentrated conductive fine particles. The solution containingconcentrated conductive fine particles may be effectivelydissolved/mixed with water, alcoholic solution, or a binder used for asol-gel process (e.g., tetraethoxysilane, triethoxysilane).

Further, an oil solution, which includes oil as a dispersant and minuteconductive fine particles dispersed therein, may be prepared as below.

First, an oil soluble polymer is dissolved in a water miscible organicsolvent (e.g. acetone) and mixed with metal ion aqueous solution.Although this mixture is a heterogeneous system, metal fine particlesare extracted toward an oil phase in a manner dispersed in the polymerwhen alkanolamine is added while agitating the mixture. Byconcentrating/drying the mixture, a solution containing concentratedconductive fine particles can be obtained. The solution containingconcentrated conductive fine particles can be effectivelydissolved/mixed with a solvent, such as an aromatic compound, a ketonecompound, or an ester compound, or a resin, such as polyester resin,epoxy resin, acryl resin, or polyurethane resin, for example.

Although the density of conductive fine particles in such solution maybe a maximum of 80% by weight, the solution containing conductive fineparticles is suitably diluted according to the purpose for use. In thesolution containing conductive fine particles, the conductive fineparticles included therein is, typically, 2% to 50% by weight, thesurfactant and resin included therein is 0.3% to 30% by weight, and theviscosity thereof is 3 to 30 centipoise, for example.

By using any one of the above-mentioned materials, in an exemplaryembodiment of the present disclosure, wiring patterns and electronicdevices are formed by vaporizing (evaporating) volatile component in thesolution so as to deposit solid content on a substrate. Such solidcontent may become wiring patterns or electronic devices on thesubstrate, and the solvent (volatile component) is used as a vehicle fordispensing the above-mentioned solution with inkjet method.

Further, a solution dispensed as droplet 43 may be, for example, any oneof a I-VII group semiconductor compound, such as CuCl, a II-VI groupsemiconductor compound, such as CdS, CdSe, etc., a III-V groupsemiconductor compound, such as InAs, a semiconductor crystal of a IVgroup, a metal oxide, such as TiO₂, SiO, SiO₂, etc., an inorganiccompound, such as a fluorescent material, fullerene, dendrimer, etc.,and an organic compound, such as phthalocyanine, azo compound, or asolution including nanoparticles of composite materials of theaforementioned materials.

The nanoparticles, which can be used in an exemplary embodiment of thepresent disclosure, typically have a particle diameter of 0.0001 μm to0.2 μm (0.1 nm to 200 nm) and more preferably a particle diameter of0.0001 μm to 0.05 μm (0.1 nm to 50 nm). More particularly, the particlediameter is determined by taking into consideration some factors such asstability of dispersion of fine particles in a prepared solution,possibility of clogging during dispensing (or jetting), and surfaceroughness of substrate, for example.

It is to be noted that the surface of such nanoparticles may besubjected to chemical or physical processing, or an additive, such assurfactant, dispersion stabilizing agent, or antioxidant, may also beadded within a scope of the present disclosure. The nanoparticles may besynthesized with, for example, a colloid chemistry method, such as areversed micelle method or a hot THORP (thermal oxide reprocessingplant) method.

In an exemplary embodiment of the present disclosure, a solutioncontaining nanoparticles is preferably a dispersion liquid, in which thenanoparticles are dispersed in an emulsion (O/W emulsion) where acontinuous phase thereof is an aqueous phase and a dispersed phasethereof is an oil phase.

Although such aqueous phase is mainly water, a water soluble organicsolvent may be added to the water. As for the water soluble organicsolvent, there are, for example, ethyleneglycol, propylene glycol,butylene glycol, diethylene glycol, triethylene glycol, polyethyleneglycol (#200, #400), glycerin, alkylether of the aforementioned glycol,N-methylpyrrolidone, 1,3 dimethylimidazolinone, thiodiglycol,2-pyrrolidone, sulfolane, dimethylsulfoxide, diethanolamine,triethanolamine, ethanol, and isopropanol. The amount of the watersoluble organic solvent used in the aqueous dispersion medium ispreferably 30% or less by weight, and more preferably 20% by weight.

Although a range of the amount of nanoparticles included in thedispersion liquid differs depending on types of film or layer to beformed on a substrate, alignment of particles, and/or the thickness ofthe desired film (layer), it is preferably 0.01% to 15% by weight, andmore preferably 0.05% to 10% by weight. If an amount of nanoparticle istoo small, a wiring pattern or an electronic device may not have enoughlevel of functionality, and if an amount of nanoparticle is too large,jetting stability cannot be obtained when dispensing or jetting dropletswith an inkjet method.

Further, it is preferable to include a surfactant and a solvent fordispersing nanoparticles in the dispersion liquid of the solutioncontaining nanoparticles. As for the surfactant, there are, for example,anion surfactant (e.g., sodium dodecyl sulfonate, dodecylbenzenesulfonic acid natrium, lauric acid natrium, ammonium salt ofpolyoxyethelenealkylethersulfate), and nonionic surfactant (e.g.,polyoxyethylene alkylether, polyoxyethylene alkylester, polyoxyethylenesoribitan fatty acid ester, polyoxyethylene alkylphenyl ether,polyoxyethylene alkylamine, polyoxyethylene alkylamide). Such agents maybe used independently or as a mixture of two or more kinds.

A range of an amount of the surfactant in the entire solution istypically 0.1% to 30% by weight, and more preferably 5% to 20% byweight. If an amount of the surfactant is too small compared to suchrange, a water-oil separation in the aqueous dispersing liquid mayoccur, by which a pattern may not be formed or coated evenly on asubstrate when droplets are dispensed. On the other hand, if an amountof the surfactant is too great compared to such range, the viscosity inthe aqueous dispersing liquid may become too high, which may degradedroplet dispensing performance.

As for the solvent for dispersing nanoparticles, there are, for example,volatile liquids of toluene, hexane, pyridine, chloroform. A range of anamount of the solvent for dispersing nanoparticles is approximately 0.1%to 20% by weight, and more preferably 1% to 10% by weight. If an amountof the solvent for dispersing nanoparticles is too small compared tosuch range, the amount of ultra fine particles that can be included inthe aqueous dispersing liquid becomes small. On the other hand, if anamount of solvent for dispersing nanoparticles is too great compared tosuch range, a water-oil separation in the aqueous dispersing liquid mayoccur.

Further, an organic compound may be dissolved in the dispersing liquid.As for the organic compound, there are, for example,trioctylphosphinoxide (TOPO), thiophenol, photochromic compound(spiropyrane, fulgide), a charge transfer type complex, and an electronaccepting compound, in which the organic compound is preferably solid atroom temperature. In this case, an amount of organic compound in thedispersing liquid with respect to the nanoparticles is 1/10000 or moreby weight, and more preferably approximately 1/1000 to 10 times byweight.

It is to be noted that an additive, such as surfactant, dispersionstabilizing agent, or antioxidant, polymer, or a material that gelatesin a coating/drying process may be added to the suspension within ascope of the present disclosure.

The above-described solution containing nanoparticles is jetted onto asubstrate with an inkjet method and dried to form a wiring pattern or anelectronic device on a substrate.

Although a thickness of thin film of nanoparticles obtained by theaforementioned method is not restricted in any particular value, suchthickness of thin film usually ranges from a diameter of a nanoparticleto 1 mm, and more preferably approximately a diameter of a nanoparticleto 100 μm. Further, it is preferable for the nanoparticles in the thinnanoparticle film to be disposed in a manner exceeding a certaindensity. Accordingly, an average space (distance) among nanoparticles inthe nanoparticle aggregate is typically no more than 10 times of theparticle diameter of nanoparticles, and more preferably no more than 2times of the particle diameter of nanoparticles. If the average spaceamong particles is too great, nanoparticles are unable to provide acollective function.

Further, a solution dispensed as droplet 43 may be a solution includingorganic semiconductor material. For example, such organic semiconductormaterial may be n conjugated material, which may be polypyrrole, such aspolypyrrole, poly(N-substituent pyrrole), poly(3-substituent pyrrole),poly(3,4-double substituent pyrrole); polythiophene, such aspolythiophene, poly(3-substituent thiophene), poly(3,4-doublesubstituentthiophene), polybenzothiophene; polyisothianaphthenen, such aspolyisothianaphthenen; polychenylenevinylene, such aspolychenylenevinylene; poly(p-phenylenevinylene), such aspoly(p-phenylenevinylene); polyaniline, such as polyaniline, poly(N-substituent aniline), poly(3-substituent aniline),poly(2,3-substituent aniline); polyacetylene such as polyacetylene;polydiacetylene, such as polydiacetylene; polyazulene, such aspolyazulene; polypyrene such as polypyrene; polycarbazole, such aspolycarbazole, poly(N-substituent carbazole); polyselenophene, such aspolyselenophene; polyfuran, such as polyfuran, polybenzofuran;poly(p-phenylene), such as poly(p-phenylene); polyindole, such aspolyindole; polypyridazine, such as polypyridazine; polyacene, such asnaphthacene, pentacene, hexacene, heptacene, dibenzopentacene,tetrabenzopentacene, pyrene, dibenzopyrene, chrysene, perylene,coronene, terrylene, ovalene, quaterrylene, circumanthracene, aderivative of polyacene, such as triphenodioxazine, triphenodithiazine,hexacene-6,15-quinone prepared by substituting carbon atom of polyacenewith an atom of N, S, O, or functional group, such as carbonyl group;and a polymer, such as polyvinyl carbazole, polyphenylenesulfide,polyvinylenesulfide.

Further, a solution dispensed as droplet 43 may be made of oligomerhaving repeating units. For example, thiophene consisting of sixmonomer, such as α-sexythiophene, α,ω-dihexyl-α-sexythiophene,α,ω-bis(3-butoxypropyl)-α-sexythiophene, and styrylbenzene derivative,may be used.

Further, a solution dispensed as droplet 43 may be made of a metalphthalocyanine, such as copper phthalocyanine, fluorine substitutedcopper phthalocyanine; naphthalene tetracarboxylic acid diimide, such asnaphthalene 1,4,5,8-tetracarboxylic acid diimide,N,N′-bis(4-trifluoromethylbenzyl)naphthalene 1, 4,5,8-tetracarboxylicacid diimide; N,N′-bis (1H,1H-perfluorooctyl),N,N′-bis(1H,1H-perfluorobutyl), N,N′-dioctylnaphthalene1,4,5,8-tetracarboxylic acid diimide derivative, naphthalene2,3,6,7-tetracarboxylic acid diimide, and condensed ring tetracarboxylicacid diimide, such as anthracene tetracarboxylic acid diimide includinganthracene 2,3,6,7-tetracarboxylic acid diimide; fullerene, such as C60,C70, C76, C78, C84; carbon nanotube, such as SWNT (single-walled carbonnanotube); and dye compound, such as merocyanine dye, hemicyanine dye,for example.

As for such n conjugated material, following compounds are preferablyused: an oligomer having at least two of thiophene, vinylene,chenylenevinylene, phenylenevinylene, p-phenylene, and derivativesubstitution thereof as repeating unit and having 4 to 10 repeatingunits of these compounds; a polymer having 20 repeating units or more ofthese compounds; aromatic compound having condensed multiple-ring;fullerene; tetracarboxylic acid diimide having condensed ring; and metalphthalocyanine, for example.

The other organic semiconductor material that can be used for thedroplet 43 may be organic molecule complex, such as tetrathiafulvalene(TTF)-tetracyanoquinodimethane (TCNQ) complex,bisethylenetetrathiafulvalene (BEDTTTF)-perchloric acid complex,BEDTTTF-iodine complex, and TCNQ-iodine complex. Further, a solutiondispensed as droplet 43 may be a conjugated polymer, such as polysilane,polygermane, for example.

An organic semiconductor material, mainly composed of polymer having arepeating unit shown as general formula (1), is preferably used in anexemplary embodiment of the present disclosure. Such organicsemiconductor material and a synthetic method thereof are described.

For example, carbonyl compound shown as general formula (2) andphosphorus compound shown as general formula (3) are reacted to obtainpolymer having a plurality of repeating units including carbon-carbondouble bond shown as general formula (4).

In general formula (2), A1 and A2 represent monocyclic or polycyclic ofallylene group or hetero allylene group, which is substituted ornot-substituted; R1 represents hydrogen, substituted or not-substitutedalkyl group, and substituted or not-substituted aryl group; V represents—O—, —S—, NR2—(R2 represents monocyclic or polycyclic allylene group,which is substituted or not-substituted, or monocyclic or polycyclichetero allylene group, which is substituted or not-substituted), and nrepresents zero or more than zero (n≧0).

In general formula (3), A3 and A4 represent monocyclic or polycyclic ofallylene group or hetero allylene group, which is substituted ornot-substituted; R3 represents hydrogen, substituted or not-substitutedalkyl, aryl, or heteroaryl group; W represents —O—, —S—, —NR4—(R4represents monocyclic or polycyclic allylene group, which is substitutedor not-substituted, or monocyclic or polycyclic hetero allylene group,which is substituted or not-substituted); m represents zero or more thanzero (m≧0); x represents PO(OR5)2 (R5 represents lower alkyl group) orP(R6)3+Y—(R6 represents substituted or not-substituted aryl group, orsubstituted or not-substituted alkyl group); and Y represents halogenatom.

Although base compounds, which can be dissolved in nonaqueous solventuniformly, can be used for preparing an organic semiconductor material,preferably, a base compound, such as metal alkoxide, metal hydride,organic lithium compound, or the like, is used in view of alkalinity andformation of phosphonatecarbanion.

For example, potassium t-butoxide, sodium t-butoxide, lithiumt-butoxide, potassium 2-methyl-2-butoxide, sodium 2-methyl-2-butoxide,sodium methoxide, sodium ethoxide, potassium ethoxide, potassiummethoxide, sodium hydride, potassium hydride, methyllithium,ethyllithium, propyllithium, n-butyllithium, s-butyllithium,t-butyllithium, phenyllithium, lithium amide, and lithiumdiisopropylamide can be used.

A solvent for dissolving a base compound may need to dissolve the basecompound as a stable solution, and to have a good solubility of the basecompound. Further, such solvent may need a property, which may not causea degradation of solubility of a high-molecular weight compound in areaction solvent, in which a high-molecular weight compound is formed,and such solvent may need to dissolve a resultant high-molecular weightcompound effectively. Such solvent may be selected from alcohol, ether,amine, carbon hydride solvent or the like, depending on property of abase compound and a high-molecular weight compound.

Examples of solution having a base compound and a solvent solving thebase compound uniformly are: sodium methoxide/methanol solution, sodiumethoxide/ethanol solution, potassium t-butoxide/2-propanol solution,potassium t-butoxide/2-methyl-2-propanol solution, potassiumt-butoxide/tetrahydrofuran solution, potassium t-butoxide/dioxanesolution, n-butyllithium/hexane solution, methyllithium/ether solution,lithium t-butoxide/tetrahydrofuran solution, lithiumdiisopropylamide/cyclohexane solution, potassiumbistrimethylsilylamide/toluene solution, or the like, for example. Someof such solutions are commercially available.

From a viewpoint of mild reaction condition and easiness of handling,metal alkoxide solution is preferably used. From a viewpoint ofsolubility of resultant polymer, easiness of handling, reaction rateefficiency, metal t-butoxide ether solution is more preferably used, andpotassium t-butoxide tetrahydrofuran solution is further preferablyused.

A solution having same amount of phosphorus compound and aldehydecompound in terms of stoichiometric quantities may be mixed with a basecompound solution having a base compound of two times or more of moleamount of phosphorus compound and aldehyde compound for polymerizationreaction, by which a high-molecular weight polymer having a smallerrange of molecular weight distribution may preferably be obtained.Although an amount of base compound may be set equal to an amount ofphosphorus compound for polymerization reaction, an excess amount ofphosphorus compound may be used for polymerization reaction because suchexcess amount may not cause problem for reaction.

Such polymerization reaction can be conducted by adding a base solutionto a solution of phosphorus compound and aldehyde compound, by adding asolution of phosphorus compound and aldehyde compound to a basesolution, or by adding a base solution and a solution of phosphoruscompound and aldehyde compound to a reaction system at the same time.Accordingly, such solutions can be added in any order.

Such polymerization reaction may be conducted with a polymerizationreaction time, set depending on reaction rate of monomer and desiredmolecular weight of resultant polymer. For example, a polymerizationreaction time of 0.2 hours to 30 hours may preferably be set. Further, atermination agent for terminating a polymer reaction may be added to areaction solution at any given timing, such as before starting reaction,during reaction, and after reaction.

Such polymerization reaction can be conducted without controlling areaction temperature, but can be progressed at room temperature in agood manner. However, such reaction temperature may be increased toenhance reaction efficiency, or can be decreased to set a mild reactioncondition.

A description is now given to an example of a polymer of organicsemiconductor material preferably used in an exemplary embodiment.However, other polymers within a scope of the present disclosure can bealso used.

A measurement of polymer was conducted as follows. A measurement ofnumber average molecular weight (Mn), weight-average molecular weight(Mw), and molecular weight distribution (Mw/Mn) was conducted with a gelpermeation chromatography (GPC), and resultant polymer was calculated aspolystyrene compound based on UV (ultra violet) absorption rate anddifferential refractive index using monodisperse polystyrene asreference polymer.

An example of a polymer of organic semiconductor material was preparedas follows. Specifically, dialdehyde of 0.852 g (2.70 mmol), shown inchemical formula (5), and diphosphonate of 1.525 g (2.70 mmol), shown inchemical formula (6) were put in a 100 ml flask, and substituted withnitrogen, and then tetrahydrofuran of 75 ml was put in the flask. Then,dm-3 tetrahydrofuran solution of 6.75 ml (6.75 mmol) having potassiumt-butoxide of 1.0 mol was dropped to the flask, and the solution wasagitated for 20 hours at room temperature. Then, benzylphosphonate andbenzaldehyde were added to the flask, and the solution was agitated for2 hours and 30 minutes. Then, acetic acid of 1 ml was added to the flaskto end the reaction, and the solution was washed with water. Afterremoving solvent under a depressurized condition, residual was dissolvedin tetrahydrofuran of 15 ml and methanol of 80 ml, and the precipitatedand purified to obtain a polymer shown in chemical formula (7) for 1.07g.

The resultant polymer, measured for molecular weight and molecularweight distribution, had a yield of 73%, a weight average molecularweight (Mw) of 104000, a number average molecular weight (Mn) of 36000,a molecular weight distribution (Mw/Mn) of 2.89, and number of repeatingunits of polymer of 63.

Instead of such polymer, other materials can be used as organic thinfilm formed on a substrate. For example, a material such as pentacenehaving a property that its precursor is soluble in a solvent can beapplied on a substrate as a thin film using an inkjet method or the likeand by applying heat treatment to such thin film.

Further, a solution dispensed as droplet 43 may be made of a precursorsubstance of silicon glass, used as insulation layer for semiconductor,or a material for quartz glass. Such precursor substance may bepolysilazane (e.g., product of TonenGeneral Sekiyu K. K.) and organicSOG (spin on glass) material, for example.

Further, an electrode may be made of material such as electricallyconductive polymer having an enhanced electric conductivity by doping.For example, such electrically conductive polymer may be conductivepolyaniline, conductive polypyrrole, conductive polythiophene (e.g.,complex of polyethylenedioxythiophene and polystyrenesulfonic acid).Further, a solution dispersing nanoparticles (having a size of 1 nm to50 nm) of platinum, gold, or silver may preferably be used for forming awiring pattern and an antenna pattern for a RFID (radiofrequencyidentification) device, to be described later.

In an exemplary embodiment of the present disclosure, a solutiondispensed as droplet 43 may include any electronic function material forfabricating a wiring pattern or an electronic device. Accordingly, suchelectronic function material may include conductive materials, describedin this disclosure, and insulating materials.

By using such solution including organic semiconductor materials orinsulating materials, an organic thin film transistor shown in FIGS. 15and 16 can be formed, for example. Such organic thin film transistor maybe a top gate type or bottom gate type, for example. In case of top gatetype, an organic thin film transistor includes a source electrode and adrain electrode on an organic semiconductor layer formed on a substrate,such as paper-based material, and a gate electrode is formed over thesource electrode, the drain electrode, and the organic semiconductorlayer via a gate insulation layer. In case of bottom gate type, anorganic thin film transistor includes a gate electrode and a gateinsulation layer formed on a substrate, and an organic semiconductorlayer formed on the gate insulation layer, and a source electrode and adrain electrode formed on the organic semiconductor layer.

FIG. 15 illustrates an example of an organic thin film transistor of topgate type. As illustrated in FIG. 15, an organic semiconductor layer 58is formed on a substrate 50, such as paper-based material, and a sourceelectrode 54 (as first electrode) and a drain electrode 55 (as secondelectrode) are formed and electronically connected on the organicsemiconductor layer 58. Further, a gate insulation layer 56 is formedover the source electrode 54, the drain electrode 55, and the organicsemiconductor layer 58, and then a gate electrode 57 (as thirdelectrode) is formed on the gate insulation layer 56, wherein the gateelectrode 57 is positioned between the source electrode 54 and the drainelectrode 55. A voltage is applied to the source electrode 54 and thedrain electrode 55, and a voltage is applied to the gate electrode 57for controlling a transistor.

FIG. 16 illustrates an example of an organic thin film transistor ofbottom gate type. As illustrated in FIG. 16, a gate electrode 57 isformed on a substrate 50, such as paper-based material, and a gateinsulation layer 56 and an organic semiconductor layer 58 are formedover the gate electrode 57 in this order. Then, a source electrode 54and a drain electrode 55 are formed and electronically connected on theorganic semiconductor layer 58, and a sealing layer 59 is formed overthe organic semiconductor layer 58. A voltage is applied to the sourceelectrode 54 and the drain electrode 55, and a voltage is applied to thegate electrode 57 for controlling a transistor.

As described above, in an exemplary embodiment of the presentdisclosure, an electronic device can be formed on packaged productsconveyed on a conveyance belt or package substrates (e.g., paper sheet,resin film, corrugated cardboard) by jetting solutions includingelectronic function materials to the packaged products or packagesubstrates. Such electronic device may be a RFID (radio frequencyidentification) device, for example.

The RFID device may include a memory, an electronic circuit, and acompact-sized antenna. Such memory may be SRAM (static random accessmemory), EEPROM (electrically erasable and programmable read onlymemory), FeRAM (ferroelectric random access memory), or the like. Amemory type to be used is determined based on factors such as runningcost. For example, in an exemplary embodiment of the present disclosure,it is preferable to use a RFID device having reduced cost because suchRFID device attached to packaged products may be discarded with packageswhen packaged products are delivered to given destinations and a memorymay not need to have a greater capacity considering a usage of such RFIDdevice. Accordingly, an EEPROM or FeRAM, which have a memory capacity ina range of a hundred bytes to several kilo bytes and do not need a powersupply for storing information or data, may preferably be used, forexample. The RFID device may employ an electromagnetic induction typedata transmission over a given transmission distance such as one meter,for example.

A description is given to an example of a method of data transmission ofa RFID device with reference to FIG. 17, in which a RFID 81 and areader/writer 82 are shown. As shown in FIG. 17, the RFID 81 includes aloop coil antenna 83, and the reader/writer 82 includes a loop coilantenna 84, in which a magnetic flux 85 is generated between loop coilantennas 83 and 84. The reader/writer 82 may emit a transmission signal87, and the RFID 81 may receive a receiving signal 86.

In data transmission in the example of FIG. 17, which useselectromagnetic induction, the loop coil antenna 84 of the reader/writer82 and the loop coil antenna 83 of the RFID 81 may be faced anddistanced each other within a given range such as one meter range. Asignal current having a frequency of 135 kHz or less (e.g., about 100kHz) or 13.56 MHz may be applied to the reader/writer 82 to generate aninduction field around the loop coil antenna 84 so thatpower/information can be transmitted with such induction field. Suchinduction field may have good level of intensity even in a usageenvironment that is not good, and thereby a data transmission can beconducted reliably.

Further, because the reader/writer 82 may have relatively widerdirectional characteristics, such RFID 81 and reader/writer 82 maypreferably be used for a conveyance system (or transport system) in anexemplary embodiment of the present disclosure. Although the loop coilantenna 83 of the RFID 81 is illustrated having a three dimensionalstructure in FIG. 17, such loop coil antenna 83 can be formedtwo-dimensionally by using a jet head in an exemplary embodiment. SuchRFID 81 having integrated circuits can be formed on a substrate bystacking different patterns one on the other, which are formed byjetting solutions including different electronic function materials,wherein such process can be conducted with a given printing technique asdescribed above. FIG. 18 illustrates a plan view of an example of a RFIDdevice formed with a method according to an exemplary embodiment, inwhich the RFID device includes an electronic circuit 88, a memory 89 andan antenna 90.

Conventionally, a RFID chip is manufactured by combining an electroniccircuit and an antenna, which are first separately prepared as anelectronic circuit, manufactured by a semiconductor manufacturingprocess, and an antenna or the like, manufactured by another process.

On the other hand, in an exemplary embodiment of the present disclosure,a RFID device can be formed on a substrate such as corrugated cardboardby using a given printing process, which can form RFID device at reducedcost. Because a RFID device can be formed on a packaging member such ascorrugated cardboard, paper sheet, resin sheet, directly with a printingprocess using jetting technique, a commercial or industrial value ofsuch package member may be enhanced. For example, such RFID device canbe used to store history information or traceability information ofcommercial goods. Further, because such RFID device is directly formedon a package by using a printing process, such electronic device may beremoved only when the package is broken or destroyed, and may be used asdeterrence for data tampering or the like. Further, a RFID device can bemanufactured by combining a RFID chip, manufactured from silicon wafer,and an antenna formed on a packaging member with the above-describedprinting process and connected to the RFID chip.

As described above, a RFID device can be formed on a packaged productsconveyed on a conveyance system (or transport system) using the jet head6 shown in FIG. 3, or a RFID device can be formed on a packaging memberby using the above-described printing process before such packagingmember is used for packaging a product.

As described above, a RFID device has a functionality preferably usedfor a logistic or delivery system. However, such RFID device attached onpackaged products may be used in adverse environments. For example, aRFID device may be exposed to wind and weather, direct sunlight,contacting other products, clashing, impact shock, vibration, which maycause damage or malfunction to the RFID device. In view of such adverseenvironments, a RFID device formed on packaged products may be coveredor laminated with a resin film to protect the RFID device in anexemplary embodiment of the present disclosure. Such resin film may bemade of polyvinyl chloride resin, polypropylene resin, or the like, forexample. Further, polypropylene resin, known as environment friendlyhigh-polymer resin materials, may be used as resin film. Further, anultraviolet absorber such as fine particles of titanium oxide or zincoxide is preferably added to such resin materials, for example, tosuppress an effect of ultraviolet ray.

Further, such resin film may be formed over a RFID device by jetting asolution including protecting agent such as resin to a face having theRFID device by using the covering agent attaching unit 8. In this case,a wax material, which can melt at a higher temperature and can solidifyat an air temperature such as 40 degrees Celsius or less, can be used.Further, such resin film may be formed over a RFID device by using aroller coating method. With such protecting agent, a RFID device formedon packaged products can be used reliable manner with respect to waterresistant, impact resistance, sun proof, contamination resistance,insulation performance, or the like.

Further, a reliability of a RFID device may be enhanced by forming aplurality of electronic devices on one packaged product. RFID devicescan easily be formed on a surface of paper or the like having arelatively rough surface, as described above, and such RFID devices mayhave a lower yield and lower quality compared to an IC or LSI formed ona silicon wafer. In view of such condition, a plurality of electronicdevices may be formed on a packaged product while distancing each of theelectronic devices. Because electronic devices can be formed on apackaged product with an inkjet method, there is no substantialdifference in device forming time between forming one electronic deviceand forming a plurality of electronic devices. If a plurality ofelectronic devices are formed on a packaged product, product informationor data stored in electronic devices can be reliably attached to thepackaged product during a logistic or delivery process even if someelectronic devices malfunction. For example, electronic devices formedon a poor-conditioned surface of one packaged product may be substitutedby electronic devices formed on a good-conditioned surface of the samepackaged product, or damaged electronic devices may be substituted bynot-damaged electronic devices if a plurality of electronic devices areformed on a packaged product.

A description is now given to anther aspect of the present disclosure.As described above, an electronic device such as RFID can be formed on asurface of a package member (e.g., paper) used for a packaged productwith an inkjet method.

In some cases, such electronic device may be used for handling apackaged product in a relatively short period of time after forming suchelectronic device on the packaged product, and in another case, suchelectronic device may be used for handling a packaged product in arelatively longer period of time after forming such electronic device ona packaged product. For example, packaged products may be deposited in awarehouse for several months before actually handled by a logisticsystem or the like. Therefore, a time lag may occur between a deviceforming timing and a device using timing.

Such time lag may affect a functionality of electronic device in somecases. Although electronic devices formed with a method according to anexemplary embodiment of the present disclosure, in some instances, maynot have a battery therein as a power source, such electronic devicescan include a battery therein as a power source depending on needs ofelectronic devices. If an electronic device embedded with a battery maynot be used for a long period of time after forming such electronicdevice on a packaged product (e.g., deposited in a warehouse for severalmonths), such electronic device may not be effectively used when suchelectronic device actually needs to be used due to a power consumptionduring such unused time period.

In view of such time lag effect of electronic devices, a redundantconductive pattern may be included in an electronic device when formingan electronic device on a packaged product or a package member. Suchredundant conductive pattern may be used to prevent a functionality loss(e.g., power loss of battery) of electronic device. In other words,unless such redundant conductive pattern is cut, an electronic device isnot activated, and when a wiring connection of such redundant conductivepattern is cut, the electronic device can be activated.

Further, such redundant conductive pattern may also be included in anelectronic device having no battery. In this case, the redundantconductive pattern may function to maintain an electronic device in adeactivated condition. In other words, as long as the redundantconductive pattern is in intact, the electronic device may notcommunicate data or information with other devices (e.g., informationreader), and when the redundant conductive pattern is cut, theelectronic device may be able to communicate data or information withother devices.

Accordingly such redundant conductive pattern may function as a switchfor activating a functionality of the electronic device. Once theelectronic device is activated by cutting a wiring connection of suchredundant conductive pattern, such electronic device can be used forinformation transmission or reception, used for managing packagedproducts.

Further, because an electronic device is not activated when suchredundant conductive pattern is intact (e.g., no cut), data orinformation stored in the electronic device cannot be read in suchcondition, which may enhance information security.

Such redundant conductive pattern may be formed in a given position ofan electronic device so that such redundant conductive pattern may notcause any problem to a functionality of electronic device when suchredundant conductive pattern is cut.

Such wiring connection can be cut by a string-like member embedded in apackage member (e.g., paper), in which a redundant conductive patternmay be formed over the string-like member. When an electronic device isto be used, such string-like member is torn off so that a wiringconnection of a redundant conductive pattern is cut.

Alternatively, such wiring connection can be cut by a plastic tapeadhered on a surface of a package member wherein a redundant conductivepattern may be formed on the plastic tape. When an electronic device isto be used, such plastic tape is peeled off so that a wiring connectionof a redundant conductive pattern is cut. Alternatively, such wiringconnection can be cut by breaking a perforated line formed on a packagemember when to use an electronic device.

Alternatively, when an electronic device is to be used, such wiringconnection may be cut by a knife or the like. With such configuration, atime lag between device forming and device use may not cause a problemfor using an electronic device.

In addition, an electronic device may need to be destroyed after usingthe electronic device to prevent data leakage or data tampering from theused electronic device. In such case, the above-mentioned string-likemember, tape, perforated line or the like, can be also used. Forexample, if a string-like member, a tape, a perforated line is formedwith an electronic device, the electronic device can be easily destroyedby pulling off the string-like member, peeling off the tape, breaking apackage along the perforated line, or by cutting with a knife, forexample.

A description is now given to another aspect of the present disclosure.In an exemplary embodiment, electronic devices such as RFID, storingspecific information, are formed on packaged products so that packagedproducts can be delivered to a given destination. Such specificinformation is stored in an electronic device as electronic information.

Such electronic information may have a preferable aspect from aviewpoint of security because such electronic information is not visibleby a human eye, and also have an unpreferable aspect from a viewpoint ofviewability. For example, if someone needs to know some information forhandling products quickly, a human eye cannot recognize such informationin an electronic device. In view of such information viewability issue,packaged products may include electronic devices such as RFID, storingspecific information in electronic form, and viewable information suchas text, corresponding to the specific information stored in theelectronic devices, on a surface of packaged products, for example,depending on a need of product handling.

For example, if a package member may be a thermosensitive paper, or ifthermosensitive paper seal is attached on a packaged product, specificinformation such as production date, delivery address information,expiration date, or the like, can be written on the thermosensitivepaper as visible text with a thermal head. Further, such viewableinformation (e.g., text) can be attached on a packaged product byjetting a liquid with a jet head using an inkjet method.

Information attached as viewable information may be selected from givenspecific information stored in an electronic device depending on typesof information. For example, delivery address information of a packagedproduct and expiration date of fresh foods may be attached on a packagedproduct as viewable information.

Further, such viewable information may not be necessary expressed asletters or numbers but may be expressed as signs, symbols or figures,wherein such signs, symbols or figures, prepared by a given rule, may bevisible but readable by only relevant persons. Such method may be usefulto secure a given level of information confidentiality and viewability,required for handling packaged products, at the same time.

In this disclosure, such viewable information may include anyinformation that can be recognized by human eye, a detector, or thelike. In some case, such viewable information may not be visible undersunlight but may become visible under a given condition (e.g., UVirradiation). Accordingly, viewable information may include anyinformation that can be recognized by human eye or a detector.

The above-described method for attaching viewable information may havesome good aspects. For example, a handling person can recognizemisdelivery of packaged products by seeing such viewable information, orcan recognize an expiration date of fresh foods in one glance.

Although an electronic device is formed on a packaged product to attachinformation required for packaged products, other methods can beemployed for attaching information to packaged products.

For example, a barcode system having a barcode and a photoscanner may beused for attaching specific information to a packaged product, in whicha one-dimensional barcode, a two-dimensional code (stacked or matrixtype), a two-dimensional symbol, or the like, may be attached on asurface of a package member with a jet head using an inkjet method. Suchtwo-dimensional code or two-dimensional symbol can include a largeamount of information compared to a string of letters/numbers used asidentification information. Accordingly, such two-dimensional code maybe used as backup information for an electronic device such as RFIDdevice storing given information. Such code information can be read by aphotoscanner, designed for reading code information, a digital camera,and a cell phone having camera, or the like, but not limited thereto.Further, a conveyance system (or transport system) according to anexemplary embodiment of this disclosure, can be provided with a mobilehandy scanner having a camera or the like to read information attachedon packaged products.

The above-described viewable information including two-dimensional codeand two-dimensional symbol can be attached on packaged products with ajet head using an inkjet method. Such jet head may dispense ink, usedfor inkjet recording apparatus, which includes an aqueous or oil-basedsolvent dispersed with colorant (e.g., dye, pigment, etc.). From aviewpoint of anti-weatherability and sun proofness of ink material,pigment ink, which hardly fades, may preferably be used.

In an exemplary embodiment of the present disclosure, a solutionincluding electronic function material is jetted on a package productwith a jet head to form an electronic device on the package product.Such jet head can be also used for forming the above-described viewableinformation including two-dimensional code and two-dimensional symbol.By using a common jet head for jetting different solutions, a system forattaching information to package products can preferably be simplified.Further, a solution including electronic function material can also beused for the above-described viewable information includingtwo-dimensional code and two-dimensional symbol. Because the solutionincluding electronic function material may have a given color, suchsolution may also be used for forming the above-described viewableinformation, two-dimensional code, or two-dimensional symbol. Therefore,a solution including electronic function material may used for formingelectronic devices and also used for forming viewable information,two-dimensional code, or two-dimensional symbol.

Alternatively, another ink, which is not visible for human eye under avisible light range or natural light, may be used. For example, UVfluorescence ink, visible under ultraviolet light or black lightirradiation, can be used. If such UV fluorescence ink is used forforming viewable information, two-dimensional code, or two-dimensionalsymbol, information confidentiality can be enhanced because such UVfluorescence ink may not be visible under natural light.

Alternatively, thermochromic ink may be used as another ink forattaching information on a surface of packaged products. Thethermochromic ink may change its color from red to terra-cotta color,from purple to pink, from black to blue, for example, with moist heatingprocess. Because the thermochromic ink can change its color with aneffect of heat, it can be checked whether a packaged product is affectedby heat or not. Further, if such thermochromic ink may be used forpackaged products susceptible to heat (e.g., fresh food), such colorchange can be used for checking a degradation of products itself, forexample.

Alternatively, magnetic ink may be used as another ink for attachinginformation on a surface of a packaged product. In this case, attachedinformation formed of magnetic material may be simply detected by amagnetoresistive sensor or detector, or shape of letters printed bymagnetic ink may be read in detail magnetically, for example. Further, amagnetic stripe, which can magnetically store a large amount ofinformation, may be attached and formed on a packaged product with a jethead using an inkjet method.

The above-described viewable information, magnetically storedinformation, or the like, may be termed as added-information becausesuch information may be attached to packaged products in addition to anelectronic device.

The above-described methods for attaching information on a packagedproduct may be selected depending on factors such as usage of product,types or amount of required information, or the like.

In an exemplary embodiment of the present disclosure, packaged productsmay be formed with an electronic device such as RFID thereon to use suchelectronic device for managing logistic or delivery system of goods, andmay be further formed with viewable information (e.g., visible undernatural light or under specific light) thereon. When such viewableinformation is attached on packaged products with a jet head using aninkjet method, a positional relationship between the jet head andpackaged products may need to be adjusted with a higher precision assimilar to a case forming electronic device such as RFID on packagedproducts.

Such positional adjustment may be conducted by the guide member 4, whichwas described above with reference to FIG. 3. The guide member 4 may beused for adjusting a positional relationship between the jet head andpackaged products with a higher precision to form an electronic deviceon each of the packaged products with a higher precision. Accordingly,after forming electronic devices on packaged products, the packagedproducts may be aligned along a given position with a higher precision,and thereby such positional relationship can be used for attachingviewable information such as letters, symbols or signs on packagedproducts. Therefore, the guide member 4 may be used for adjusting arelationship between the jet head and packaged products with a higherprecision for forming electronic devices and the above-describedviewable information on packaged products with a higher precision.Alternatively, another guide member for adjusting a positionalrelationship between the jet head and packaged products may be disposedalong a conveyance line in addition to the guide member 4.

As described above, an electronic device formed on packaged products maybe covered or laminated with a resin film or the like to protect theelectronic device from wind and weather, direct sunlight, contactingother products, clashing, impact shock, vibration, and other conditionsthat may cause damage or malfunction to the electronic device. Becausethe viewable information such as letters or signs may also be exposed towind and weather, direct sunlight, contacting other products, or thelike, it is also preferable to cover or laminate such viewableinformation with resin material having ultraviolet screening function assimilar to the electronic device.

As described above, a conveyance system (or transport system) accordingto an exemplary embodiment of the present disclosure may include aconveyance unit for conveying packaged products, packaged with packagemember, an alignment unit for adjusting a position of packaged productsconveyed or transported in a given direction, and a device attachingunit for attaching electronic functional devices on packaged products,wherein the alignment unit and device attaching unit may be disposed atpositions along a conveyance route of the conveyance unit. Suchconveyance system may be usefully integrated in a uniform managementsystem, which manages products such as inventory management ofindustrial products or agricultural products using a computer system.

Further, in such conveyance system (or transport system), an electronicfunctional device is formed on a package product by jetting a solutionincluding electronic function material to the package product with a jethead using an inkjet method and depositing solid content in the solutionon the package product, by which an electronic functional device can beformed on the package product with a printing process, which usesrelatively simple process and can be conducted with a relatively lowercost.

Further, in such conveyance system, a pretreatment material may beapplied on a surface of a package member before jetting a solutionincluding electronic function material on the surface of a packagemember, and an electronic functional device having a given pattern canbe formed with higher precision and such electronic functional devicemay have a higher durability by avoiding breakings in a wire.

Further, in such conveyance system, a dry unit is disposed at aposition, which is next to the device attaching unit, along a conveyanceroute to dry a solution jetted on packaged products, and an electronicfunctional device formed on a surface of a package member may be driedwith a shorter time, and thereby such dried electronic functional devicemay not be damaged even if some objects contact the electronicfunctional device formed on a surface of a package member.

Further, the dry unit may be configured to locally heat a surface of apackage member, which bears a solution including electronic functionmaterial, and thus the dry unit may consume less energy for drying thesolution to form an electronic functional device, which is preferablyfor saving energy. Further, such localized heating may be preferable forpackaged products susceptible to heat (e.g., fresh foods) because heatdamage to products can be suppressed or prevented.

Further, because the electronic functional device may be a RFID device,the above-described conveyance system may be integrated usefully in auniform management system, which manages products such as inventorymanagement of industrial products or agricultural products, using acomputer system. For example, when industrial products or agriculturalproducts having such RFID device are conveyed or sorted on a conveyancebelt, conditions of packaged products can be traced by using RFIDdevice, or when packaged products are delivered with a logistic system,a location of packaged products may be checked by using RFID device.Further, such uniform management system may be used to manage sales dataat retail stores or the like.

Further, because the above-described electronic functional device can becovered with a resin film or the like, such electronic functional devicemay not be damaged by adverse environment, such as wind and weatherduring the transport/delivery process, which is preferable forprotecting data stored in the electronic functional device. Further,because the electronic functional device can be covered with materialthat can block ultraviolet light, such electronic functional device maynot be damaged or degraded by direct sunlight. Further, because theconveyance system includes an information writer, disposed at a positionalong a conveyance route, to write specific information or data to aRFID device, such as on industrial products or agricultural products, alogistic system for handling products can preferably be enhanced withinformation technology.

Further, because the conveyance system (or transport system) can includean information reader, disposed at a position along a conveyance route,to read specific information or data of a RFID device when suchinformation or data is stored by the RFID device, a logistic system forhandling products can preferably be enhanced with informationtechnology.

Further, because the conveyance system can also be configured with asubsystem for attaching viewable information such as letters, symbols,signs, or the like, on packaged products or goods, corresponding toelectronic information stored in an electronic function device, suchviewable information may have facilitate a checking process of packagedproducts. For example, a handling person can recognize misdelivery ofpackaged products when seeing such viewable information, or canrecognize an expiration date of fresh foods in one glance. Further,because such viewable information can be attached directly on a surfaceof a package member with a jet head using an inkjet method, suchviewable information, such as corresponding to electronic informationstored in an electronic function device, can be easily attached topackaged products.

Further, a solution including electronic function material can be jettedon a package product with a jet head to form an electronic functiondevice on the package product. Such jet head can also be used forforming the above-described viewable information, which may preferablysimplify a system for attaching information to package products.

Further, because thermochromic material, which can change its color withan effect of heat, can be applied on a packaged product, it can bechecked whether a packaged product is affected by heat or not bychecking a present color of thermochromic material. Further, because UVfluorescence ink, which is not visible for human eye under a visiblelight range or natural light but becomes visible under ultraviolet lightor black light irradiation, can be used for attaching theabove-described viewable information on a surface of a package member,and information confidentiality can be enhanced.

Further, because the viewable information such as letters, symbols orsigns may also be covered or laminated with a cover member such as resinfilm, such viewable information may not be damaged by adverseenvironment such as wind and weather during transport/delivery process,which is preferable for protecting information or data of the viewableinformation.

Further, because information scannable by a photoscanner or the like canbe attached to a surface of a package member of a packaged product, inaddition to an electronic device formed on a packaged product, with anjet head using an inkjet method, packaged products can be attached withinformation relevant for transporting/delivering products with aplurality of methods. For example, information scannable by aphotoscanner may be a barcode such as one-dimensional barcode, atwo-dimensional code (stacked or matrix type), a two-dimensional symbolor the like, wherein such information can be read by a photoscannerdesigned for reading code information, a digital camera, a cell phonehaving camera or the like, but not limited thereto.

Further, information can be attached on a surface of a packaged product,by jetting a magnetic material on a surface of a package member with ajet head using an inkjet method and storing information on amagnetically recordable area formed on a surface of a packaged product,in addition to an electronic function device such as RFID device, bywhich the above-described conveyance system can enhance its functionalextendability.

Further, because the above-described viewable information, scannableinformation, or magnetically recordable information can be configured toa part of the information stored in the electronic function device suchas RFID device, such viewable information, scannable information, ormagnetically recordable information can be used as backup information ifelectronic information stored in the RFID device is lost by accident,and such backup information may be read by a corresponding reader sothat a system down for logistic or the like can be avoided, and a systemreliability can be enhanced.

Further, because an alignment unit for adjusting a positionalrelationship between the jet head and packaged products with a higherprecision may be disposed along a conveyance line in the above-describedconveyance system (or transport system) before attaching any one of theabove-described viewable information, scannable information, andmagnetically recordable information, packaged products may be attachedwith the above-described viewable information, scannable information, ormagnetically recordable information with a higher precision, andinformation can be recognized with a higher precision, which ispreferable for suppressing or preventing malfunction in informationreading such as when the information is misread or cannot be read.

Numerous additional modifications and variations are possible in lightof the above teachings. It is therefore to be understood that within thescope of the present disclosure and appended claims, the subject matterof the present disclosure may be practiced otherwise than asspecifically described herein. For example, elements and/or features ofdifferent examples and illustrative embodiments may be combined eachother and/or substituted for each other within the scope of thisdisclosure and appended claims.

This disclosure claims priority from Japanese Patent Application No.2006-356578, filed on Dec. 28, 2006 in the Japan Patent Office, theentire contents of which are incorporated herein by reference.

1. A conveyance system, comprising: a conveying unit configured to convey objects in a given direction, each of the objects being packaged by a package member; an alignment unit disposed at a given position along a conveyance route of the conveying unit and configured to align a positional orientation of the packaged objects to a reference position when the packaged objects are conveyed by the conveying unit; and an attaching unit configured to attach at least one electronic functional device to each of the packaged objects.
 2. The conveyance system according to claim 1, wherein the attaching unit includes a jet head for jetting a solution including electronic function material to a surface of each of the packaged objects by using an inkjet method, and the electronic functional device is formed on each of the packaged objects by depositing a solid content of the solution on each of the packaged objects.
 3. The conveyance system according to claim 2, further comprising a pretreatment unit configured to apply a pretreatment material to a surface of the package member, used for each of the packaged objects, before the solution including electronic function material is jetted to each of the packaged objects.
 4. The conveyance system according to claim 2, further comprising a dry unit configured to dry the solution jetted to the packaged objects, the dry unit being disposed downstream of the attaching unit along the conveyance route.
 5. The conveyance system according to claim 4, wherein the dry unit dries a specific local area of the packaged objects, onto which the solution including electronic function material is jetted.
 6. The conveyance system according to claim 1, wherein the electronic functional device is a RFID (radio frequency identification) device.
 7. The conveyance system according to claim 6, further comprising a covering unit configured to cover the RFID device with a covering member.
 8. The conveyance system according to claim 7, wherein the covering member includes a material which blocks ultraviolet light.
 9. The conveyance system according to claim 6, further comprising a writer configured to write information to the RFID device, the writer being disposed in a downstream of the attaching unit along the conveyance route.
 10. The conveyance system according to claim 9, further comprising a reader configured to read the information stored in the RFID device.
 11. The conveyance system according to claim 1, wherein each of the packaged objects is attached with added-information including any one of character, sign, and symbol and a combination thereof.
 12. The conveyance system according to claim 11, wherein the attaching unit includes a jet head, the added-information is viewable information attached on each of the packaged objects, and the viewable information is formed by jetting through said jet head a solution having a visible coloring agent on each of the packaged objects.
 13. The conveyance system according to claim 12, wherein the solution having visible coloring agent further includes electronic function material.
 14. The conveyance system according to claim 12, wherein the solution having visible coloring agent is a solution including a thermochromic material, which changes colors with an effect of heat.
 15. The conveyance system according to claim 11, wherein the attaching unit includes a jet head, and the added-information is formed on each of the packaged objects by jetting through said jet head a solution including an ultraviolet fluorescence material, which emits light with irradiation of ultraviolet ray.
 16. The conveyance system according to claim 11, wherein the added-information is covered by a covering member.
 17. The conveyance system according to claim 11, wherein the added-information is information scannable by a photoscanner.
 18. The conveyance system according to claim 11, wherein the added-information is formed with a magnetic material, which is magnetically recognizable.
 19. The conveyance system according to claim 11, wherein the attaching unit includes a jet head, and the added-information is magnetically stored in a magnetically recordable area formed on each of the packaged objects by jetting through said jet head a solution including a magnetic material on each of the packaged objects by using an inkjet method.
 20. The conveyance system according to claim 11, wherein the added-information includes a part or all of information written in the RFID device. 